Overview

Openex provides a cutting-edge AI Vision Inspection System specifically designed for ceramic wafers and chips used in electronics and semiconductor applications. The system delivers high-speed, high-accuracy inspection that ensures every ceramic chip meets the most demanding quality standards — automatically and efficiently.

With deep expertise in machine vision, AI software, robotics, and precision mechanics, we help manufacturers around the world automate their quality control and ensure consistent, traceable production.

Our inspection systems are widely used in automotive, electronics, semiconductor, and new energy industries, trusted for their performance, reliability, and ease of integration.

Key Benefits

• Comprehensive Quality Control - 100% inspection instead of random sampling.
• AI-Powered Precision - Learns and adapts to detect subtle, previously unrecognized defects.
• Reduced Downtime - Built-in auto-cleaning and pre-filtering minimize manual intervention.
• Seamless Integration - Easily connects with MES/ERP or automated handling systems.

Specifications

• Inspection Speed: Up to 800 pcs/min
• Inspection Type: Non-contact optical inspection
• AI Capability: Deep-learning defect detection
• Defect Types: Electrode unevenness, deformation, chipping, contamination, cracks
• Machine Structure: Precision feeding + vision modules + ejector system
• Maintenance: Self-cleaning glass disk, minimal downtime
• Output: Good/NG sorting with full traceability

Key Features

High-Speed Inspection

• Inspects up to 800 pieces per minute, enabling continuous inline production without manual sampling.
• Optimized optical and mechanical design ensures both speed and precision for small, fragile components.

Smart Pre-Screening Mechanism

• Ingeniously designed feeder system automatically removes broken pieces, sharp fragments, and irregular wafers before inspection.
• Prevents damage to glass disks, minimizes material jams, and extends machine lifespan.

AI-Enhanced Defect Detection

• Powered by deep-learning vision algorithms, the system identifies even microscopic or complex surface defects.
• Detectable defects include:
  • Electrode unevenness and arcing on the electrode surface
  • Edge chipping and missing corners
  • Electrode misalignment or lack of edge margin
  • Side bending or end-face deformation
  • Edge contamination, adhered material, and color spots
  • End-face scratches and surface burrs

Automatic Glass Disk Cleaning

• Integrated self-cleaning system keeps the inspection disk clear of dust and debris.
• Saves maintenance time and prolongs the life of the glass platform.